// AI news · 2026-10-27 · IT之家
TSMC Considers 10%-20% Price Hike for Advanced Packaging
TSMC is considering a 10% to 20% price increase for its advanced packaging services, particularly CoWoS, due to surging AI demand and persistent supply chain bottlenecks.
Published 2026-10-27 14:22 (Beijing time)Source IT之家Auto-summarised, fact-checked against source
01Summary
Demand has expanded from GPUs to CPUs and custom ASICs, with longer test cycles adding pressure on packaging and testing capacity. Equipment delivery times have extended from 3–6 to 6–8 months as customers prioritize shipment schedules. Analysts project CoWoS monthly output to exceed 130,000 wafers in 2026 and reach 200,000 by 2027.
Summarised from the original article by an open-source model, then checked automatically: every number and English name must appear in the source. The original article is authoritative.
02Key points
- TSMC considering 10%-20% price hike for CoWoS packaging
- AI demand driving expansion from GPUs to CPUs and custom ASICs
- Equipment delivery extended to 6–8 months due to customer shipment prioritization
- CoWoS monthly output projected at 130k wafers in 2026, 200k in 2027
03Source
曝台积电先进封装拟涨价最高 20%，因 AI 需求急剧攀升、产能持续吃紧
IT之家 · published 2026-10-27 14:22 Beijing time
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